| Press Releases 67 to 72 of 230 |
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| 25.04.2023 10:00 |
Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs |
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Nuremberg/Willich – April 25th, 2023: Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules. Recently, Semikron Danfoss added ROHM’s new 1200V RGA IGBT to its low power module offering. In doing so, both companies show that they remain committed to serving worldwide motor drive customers’ needs. |
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| 20.04.2023 14:00 |
ROHM Industry’s Smallest Class* of Short-Wavelength Infrared (SWIR) Devices – Ideal for New Sensing Applications in Portable and Wearable Devices |
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Willich-Münchheide, Germany, April 20, 2023 – ROHM has established mass production technology for Short-Wavelength Infrared (SWIR) devices in the industry’s smallest class 1608-size (1.6mm × 0.8mm) for portable/wearable/hearable devices requiring material detection. |
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| 06.04.2023 14:00 |
ROHM’s New 4ch/6ch LED Drivers for LCD Backlights: Contribution to Lower Power Consumption in Medium to Large Automotive Displays |
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Willich-Münchheide, Germany, April 6, 2023 – ROHM developed the 4ch/6ch LED driver ICs, BD83A04EFV-M, BD83A14EFV-M, and BD82A26MUF-M designed for medium to large size automotive displays in car infotainment and instrument clusters. |
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| 04.04.2023 14:00 |
ROHM Presents High-Performance Solutions for the E-Mobility Sector, Energy Conversion and Beyond |
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Willich, Germany, April 4, 2023 – At PCIM Europe, the leading trade fair for Power Electronics, Intelligent Motion and Energy Management in Nuremberg, Germany (May 9th to 11th), ROHM Semiconductor will showcase its new power semiconductors that advance sustainable technologies – including high-performance solutions for the e-mobility sector and beyond. |
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| 21.03.2023 14:00 |
ROHM Establishes Ultra-High-Speed Control IC Technology that Maximizes the Performance of GaN Devices |
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Willich-Münchheide, Germany, March 21, 2023 – ROHM’s ultra-high-speed Control IC technology maximizes the performance of GaN and other high-speed switching devices. |
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| 20.03.2023 14:00 |
Bare die SiC from ROHM chosen by Apex Microtechnology for newest line of power modules |
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Willich-Münchheide, Germany, March 20, 2023 – ROHM has announced that precision power analog company, Apex Microtechnology, is adopting ROHM’s silicon carbide (SiC) MOSFETs and SiC Schottky Barrier Diode (SBD) for a new line of power modules. This product family currently includes the three-phase SA310 module, ideal for driving high-voltage BLDC motors, as well as two half-bridge devices, SA110 and SA111, ideal for a wide range of high-voltage applications. |
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