| Press Releases 289 to 294 of 1697 |
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| 19.04.2023 11:45 |
Infineon drives decarbonization and digitalization for a greener future with innovative semiconductor solutions at PCIM Europe 2023 |
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Munich, Germany – 19 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers power solutions such as CoolSiC™ and CoolGaN™ that enable higher energy efficiency. This makes them key to sustainable designs and an important building block for the energy transition. At PCIM Europe 2023, Infineon will showcase how its latest solutions in power semiconductors and wide bandgap technologies provide answers to the current challenges of green and digital transformation. Under the motto “Driving decarbonization and digitalization. Together.”, the company will offer numerous demonstrations, live TechTalks, and the opportunity to discuss design challenges with experts. Alternatively, industry professionals can register for the Infineon's virtual platform, which will be available around the clock from 27 April onwards. |
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| 18.04.2023 15:15 |
PROFET™ Load Guard 12V is powering up automotive ADAS and power distribution with adjustable overcurrent limitation and capacitive load switching mode |
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Munich, Germany – 18 April, 2023 – Today, almost every new car is equipped with advanced driver assistance systems (ADAS), and the automotive industry is striving for even higher automation. Such safety-critical systems require a dependable and intelligent board net architecture and, in combination with more comfort functionalities, lead to an increasing number of loads. The E/E-architecture therefore requires reliable and intelligent solutions that protect sensitive loads from overcurrent events and ensure fast fault isolation towards the power distribution system. |
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| 14.04.2023 10:00 |
Hi-Lo Systems supports Infineon’s OPTIGA™ TPM firmware programming to accelerate device manufacturers’ time-to-market |
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Munich, Germany, and Taipei, Taiwan – 14 April, 2023 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and Hi-Lo Systems, a Taiwan based IC programming and testing company, today announced their partnership in the area of Trusted Platform Module (TPM) security chips. Hi-Lo Systems has officially become an Associated Partner of Infineon in the Greater China market and will provide firmware update programming services for Infineon’s OPTIGA™ TPMs. This will help accelerate time-to-market for a wide range of device manufacturers. |
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| 03.04.2023 09:00 |
Infineon streamlines its decarbonization profile: Division for industrial applications to operate under the name Green Industrial Power (GIP) |
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Munich, Germany – 3 April 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has changed the name of its Industrial Power Control (IPC) Division to Green Industrial Power (GIP). The semiconductor manufacturer is thus highlighting its consistent alignment with the Decarbonization and Digitalization trends. For the newly named Division, green energies are key growth drivers for the business. |
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| 28.03.2023 18:43 |
Resilient business dynamics: Infineon expects stronger results for second fiscal quarter and full 2023 fiscal year |
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Munich, Germany – 28 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is updating its expectations for revenues and Segment Result Margin for the running, second quarter as well as for the full 2023 fiscal year. This is primarily based on resilient business dynamics in its core automotive and industrial segments. |
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| 23.03.2023 10:15 |
Infineon AIROC™ CYW20829 Bluetooth LE SoC ready with latest Bluetooth 5.4 specification |
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Munich, Germany – 23 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation, and automotive. |
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