Press Releases 277 to 282 of 1697
04.05.2023 16:15 Infineon’s highly integrated new wireless power transmitter IC is ideal for charging applications up to 50 W
Munich, Germany – 4 May, 2023 – Wireless charging has become an integral part of the modern battery-powered world, providing a streamlined and user-friendly experience for portable products across a wide range of industries. With the WLC1150 wireless charging transmitter IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its portfolio of wireless charging (WLC) controller ICs, offering a highly integrated, easy-to-design, and cost-effective solution for applications requiring higher wireless power transfer. These include industrial applications, healthcare equipment, robotics and drones, vacuum cleaners, power tools, docking stations, and smartphone chargers supporting Qi Extended Power Profile (EPP).
04.05.2023 07:32 Infineon concludes a significantly better-than-expected quarter and again raises its outlook for the current fiscal year
Neubiberg, 4 May 2023 – Today, Infineon Technologies AG is reporting results for the second quarter of its 2023 fiscal year (period ended 31 March 2023).
03.05.2023 09:00 Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules
Munich, Germany – 3 May, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources. Under the agreement, SICC will supply the Germany-based semiconductor manufacturer with competitive and high-quality 150-millimeter wafers and boules for the manufacturing of SiC semiconductors, covering a double-digit share of the forecasted demand in the long term.
03.05.2023 09:00 Infineon announces supplier agreement on wafers and boules with Chinese silicon carbide supplier TanKeBlue to diversify its supply base even further
Munich, Germany – 3 May 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is diversifying its silicon carbide (SiC) supplier base and has signed a long-term agreement with Chinese SiC supplier TanKeBlue to secure additional competitive SiC sources. TanKeBlue will supply the Germany-based semiconductor manufacturer with competitive and high-quality 150-millimeter SiC wafers and boules for the manufacturing of SiC semiconductors, covering a double-digit share of the forecasted demand in the long term.
02.05.2023 15:48 Infineon breaks ground for new plant in Dresden together with EU Commission President Ursula von der Leyen, German Federal Chancellor Olaf Scholz, Saxony's Prime Minister Michael Kretschmer and Dresden’s Mayor Dirk Hilbert
Munich and Dresden, Germany – 2 May 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has broken ground for a new plant in Dresden together with political leaders from Brussels, Berlin and Saxony. EU Commission President Ursula von der Leyen, German Federal Chancellor Olaf Scholz, Saxony's Prime Minister Michael Kretschmer and Dresden's Mayor Dirk Hilbert symbolically launched construction work together with Infineon CEO Jochen Hanebeck. With an investment volume of five billion euros, the new plant is the largest single investment in Infineon's history.
02.05.2023 08:40 Groundbreaking Smart Power Fab Dresden (Notes)
You can follow the ceremony via live webcast. Immediately after the event, a press release will be published with the latest photo material. On request, we provide TV stations with video footage of Infineon Dresden.
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