| 19.07.2023 14:30 |
Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assembly |
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Munich, Germany – 19 July, 2023 – As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels. Acknowledging energy efficiency as an important concern, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses these megatrends with its silicon carbide (SiC) CoolSiC™ MOSFET 650 V in TO leadless (TOLL) packaging. The new SiC MOSFETs are enhancing Infineon’s comprehensive CoolSiC portfolio and are optimized for the lowest losses, the highest reliability, and ease-of-use in applications such as SMPS for servers, telecom infrastructure as well as energy storage systems and battery formation solutions. |
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| 18.07.2023 13:15 |
Flexibility meets increased power density and performance: Infineon extends 1200 V 62 mm IGBT7 portfolio with new maximum current rating |
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Munich, Germany – 18 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 62mm half-bridge and common emitter module portfolio with 1200 V TRENCHSTOP™ IGBT7 chips. The wide range of offerings in the proven 62mm housing is extended with the new 800 A maximum current class for the package family. The addition to the portfolio’s current classes provides system designers with a high degree of flexibility in designing higher current power solutions while offering higher power density and electrical performance. It is tailored to meet the needs of solar central inverters as well as industrial drive applications and uninterruptible power supplies (UPS). Additionally, EV charging, energy storage systems (ESS) and other new industrial applications can be covered. |
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| 17.07.2023 14:15 |
Infineon expands portfolio for data logging memory; introduces industry’s first 1Mbit automotive-qualified serial EXCELON™ F-RAM and adds 4Mbit density |
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Munich, Germany – 17 July, 2023 – The evolving market for automotive event data recorders (EDR) is driving demand for specialized data-logging memory devices that instantly capture and reliably store critical data for decades. Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities to its EXCELON™ F-RAM family. The 1Mbit devices are the industry’s first automotive-qualified serial F-RAMs available. |
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| 14.07.2023 11:15 |
Smart power switch family Power PROFET™ + 12V enables modern power distribution architectures with lowest ohmic switches for automotive applications |
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Munich, Germany – 14 July, 2023 – Since relays and fuses cannot meet the requirements of modern E/E vehicle architectures, partial or complete electrification of the primary and secondary power distribution must be taken into account. To address this issue, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new generation of ultra-low ohmic high-side switches in a TO-leadless package, the Power PROFET™ + 12V switch family. |
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| 12.07.2023 14:15 |
Partnership reinforced: Infineon and Semikron Danfoss sign supply agreement for electromobility chips |
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Munich and Flensburg, Germany – 12 July, 2023 – Cars with fully or partially electrified drivetrains will account for two thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors. Against this background, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will supply chipsets consisting of IGBTs and diodes to Semikron Danfoss. These chips are mainly used in power modules for inverters, which are used for the main drive in electric vehicles. |
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| 07.07.2023 10:15 |
Infineon further extends its edge AI capabilities and choice-of-platforms for Machine Learning-based models for Bluetooth customers by partnering with Edge Impulse |
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Munich, Germany – 7 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it is teaming with Edge Impulse to extend its Tiny Machine Learning-based AI development tools for the PSoC™ 63 Bluetooth® LE microcontroller (MCU). Developers of AI-enabled IoT applications can now also build edge Machine Learning (ML) applications using the Edge Impulse Studio environment for deployment on high-performance, low-power PSoC 63 Bluetooth LE MCUs. |
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