| Press Releases 199 to 204 of 1696 |
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| 24.11.2023 14:15 |
ETAS and Infineon receive NIST CAVP certification for ESCRYPT CycurHSM implemented on AURIX microcontrollers |
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Munich and Stuttgart, Germany – 24 November, 2023 – ETAS GmbH, a leading solution provider for Software Defined Vehicles (SDV), and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have successfully certified their cryptographic algorithm suite. The certificate was validated under the Cryptographic Algorithm Verification Program (CAVP) of the National Institute of Standards and Technology (NIST) and granted for ESCRYPT CycurHSM. This automotive embedded security software stack is implemented on Infineon’s second-generation AURIX™ TC3xx hardware security module (HSM). |
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| 24.11.2023 10:15 |
Infineon @ TRUSTECH 2023: Mini airport booth displays TEGRION™ and SECORA™ Pay demos for high performance government IDs and payment |
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Munich, Germany, and Paris, France – 24 November, 2023 – At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will present the latest member of the TEGRION™ family, which accelerates future-proof ID applications. Infineon’s mini airport booth will also feature the world’s first PQC-enabled ePassport demonstrator. In addition, visitors can experience the convenience of seamless payment with SECORA™ Pay X, which will be demonstrated in a pop-up manicure salon for fingernails suitable for contactless payment. |
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| 23.11.2023 10:00 |
European research project PROGRESSUS paves the way for decarbonization with improved power grid resilience |
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Munich, Germany – 23 November, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) – Intelligent management of power loads and power sources can make existing power networks more robust in order to handle the growing share of green energy. At the conclusion of the PROGRESSUS research project 22 project partners presented the project's results in Bari, Italy. Among other things, a solution was introduced which would make it possible to operate ten to fifteen times more electric car charging stations on a single network connection. In addition, a strategy for tracking electricity from generation all the way to consumption was presented. PROGRESSUS focused on three central topics: Efficient energy conversion, intelligent electricity management and secure network monitoring. |
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| 22.11.2023 11:15 |
Infineon introduces the 650 V CoolMOS™ CFD7A for energy-efficient fast electric vehicle charging |
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Munich, Germany – 22 November 2023 – The accelerated transition to electric vehicles has led to significant innovations in charging systems that demand more cost-efficient and high performing power electronics. Addressing this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 650 V CoolMOS™ CFD7A portfolio by introducing the QDPAK package. This package family is designed to provide equivalent thermal capabilities with improved electrical performance over the well-known TO247 THD devices, thus enabling efficient energy utilization in onboard chargers and DC-DC converters. |
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| 21.11.2023 10:15 |
SECORA™ Pay security solution “lights up” payment cards with LEDs to enhance contactless payment experience |
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Munich, Germany – 21 November, 2023 – Enabled by increasingly powerful technologies the convenience of tap and pay is being widely adopted, fueling the rise of contactless payments worldwide. In addition, contactless technologies are inspiring new and innovative form factors that support additional functions beyond payment. The SECORA™ Pay security solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) takes this development into account and supports card inlays with LEDs. The Visa- and Mastercard-certified product family now enables banks to design new and distinctive payment cards. Embedded LEDs provide visual feedback when the card is held up to the point-of-service (POS) terminal for a payment transaction. |
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| 20.11.2023 10:15 |
New 62mm package in Infineon’s CoolSiC™ portfolio helps engineers to achieve higher efficiency and power density |
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Munich, Germany – 20 November, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion of its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The proven 62mm device is designed in half-bridge topology and is based on the recently introduced and advanced M1H silicon carbide (SiC) MOSFET technology. The package enables the use of SiC for mid-power applications from 250 kW – where silicon reaches the limits of power density with IGBT technology. Compared to a 62mm IGBT module, the list of applications now additionally includes solar, server, energy storage, EV charger, traction, commercial induction cooking and power conversion systems. |
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