| 07.02.2024 14:30 |
Infineon and Worksport collaborate to reduce weight and cost of portable power stations with GaN |
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Munich, Germany and West Seneca, NY, USA – 7 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has announced a collaboration with Worksport Ltd. (Nasdaq: WKSP; WKSPW). Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density. Enabled by Infineon’s GaN transistors, the power converters will be lighter and smaller in size with reduced system costs. In addition, Infineon will support Worksport in the optimization of circuits and layout design to further reduce size and increase power density. |
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| 06.02.2024 07:33 |
Infineon with robust Q1 FY 2024. Market environment outside automotive remains weak. Weaker currency and markets are leading to an adjustment of FY 2024 outlook |
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Neubiberg, 6 February 2024 – Today, Infineon Technologies AG is reporting results for the first quarter of the 2024 fiscal year (period ended 31 December 2023). |
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| 05.02.2024 14:15 |
Infineon and VMAX intensify collaboration for energy-efficient and cost-effective fast charging of electric vehicles |
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Munich, Germany – 5 February 2024 – VMAX, a leading Chinese manufacturer of power electronics and motor drives for new energy vehicles, has selected the new CoolSiC™ hybrid discrete with TRENCHSTOP™ 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next generation 6.6 kW OBC/DCDC on-board chargers. Infineon’s components come in a D²PAK package and combine ultra-fast TRENCHSTOP 5 IGBTs with half-rated free-wheeling SiC Schottky barrier diodes to achieve a perfect cost-performance ratio for both hard and soft switching topologies. With their superior performance, optimized power density and leading quality, the power devices are ideally suited for VMAX’s on-board chargers. |
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| 01.02.2024 08:00 |
Infineon and Honda enter strategic collaboration and sign MoU to collaborate on automotive semiconductor solutions |
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Munich, Germany and Tokyo, Japan – 1 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Honda selects Infineon as semiconductor partner to align future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies. |
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| 31.01.2024 14:15 |
Infineon teams with Framework to launch an upgradeable, customizable, repairable laptop with advanced USB-C connectivity |
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Munich, Germany and San Francisco, CA, USA – 31 January 2024 – The issue of e-waste and disposable laptops has become a growing concern for many consumers looking for more sustainable options for their technology products. In response, Framework Computer Inc., in collaboration with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), has recently launched their latest product, the Framework Laptop 16. This laptop is the first consumer product to support 180 W and 240 W USB-C, thanks in large part to the use of the highly integrated dual/single port USB-C PD controller with Extended Power Range (EPR) support, EZ-PD™ CCG8. |
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| 30.01.2024 11:15 |
Infineon presents hybrid Time of Flight (hToF): Advanced technology for next-generation smart robots |
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Munich, 30 January 2024 – In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots. |
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