| 14.02.2006 13:00 |
Infineon Expands Its Offering of Feature- and Cost-Optimized Solutions for the Industrial Market; Launches New 8-bit, 16-bit and 32-bit Microcontrollers Leveraging its Automotive Expertise |
|
Munich, Nuremberg, Germany - February 14, 2006 - Today at the Embedded World show 2006 in Nuremberg (February 14 -16), Infineon Technologies (FSE/NYSE: IFX) announced the availability of new microcontroller (MCU) products. The new Flash MCUs, including 8-bit, advanced 16-bit and high-end 32-bit TriCore... |
 |
|
| 14.02.2006 12:00 |
Infineon Multimedia Platform Solution is Selected for Panasonic New UMTS Handsets |
|
Munich, Germany - February 14, 2006 - Infineon Technologies AG (FSE/NYSE: IFX) today announced that Panasonic Mobile Communications Co. Ltd. has chosen Infineon as supplier of the reference design platforms for its new 3G mobile handsets. Infineon’s platform MP-EU will be used in the future UMTS ... |
|
|
| 13.02.2006 08:00 |
Infineon Technologies 3G Platform Selected by Vodafone |
|
Munich, Germany - February 13, 2006 - Infineon Technologies AG, a leading supplier of communications products, announced today that Vodafone, the world’s largest mobile community, will evaluate the company’s UMTS dual mode platform. The first 3G mobile phones based on Infineon’s MP-EU UMTS multimedia... |
|
|
| 13.02.2006 08:00 |
Infineon Brings HSDPA High-Speed Data Access with Data Rates of up to 7.2 Mbit/s to Mass Market Mobile Phones, Offers Complete Scalable Multimedia Phone Solution |
|
Munich, Germany / Barcelona, Spain - February 13, 2006 - Infineon Technologies AG (FSE/NYSE: IFX) today, at the 3GSM World Congress in Barcelona, announced sample availability of its latest baseband processor supporting HSDPA (High-Speed Downlink Packet Access) data rates of up to 7.2 megabits per ... |
|
|
| 13.02.2006 08:00 |
New Infineon Mobile Phone Chip Sets New Industry Standard for Ultra Low-Cost Handsets, Shrinks Electronic Component Count to Fewer Than 50 and Cuts Manufacturer Cost to US |
|
Munich, Germany and Barcelona, Spain – February 13, 2006 – The latest chip from Infineon Technologies AG (FSE/NYSE: IFX) reduces the number of electronic components in a basic mobile phone from about 100 to fewer than 50. In addition to providing the user the basic ability to make telephone calls ... |
|
|
| 10.02.2006 13:00 |
Infineon Announces Availability of Innovative Integrated Semiconductor Solutions to Drive Future Mobile Communications |
|
Munich - February 10, 2006 - Infineon Technologies (FSE/NYSE: IFX), a leading supplier of advanced communication ICs and solutions, today announced sample availability of its latest baseband processor for multimedia mobile phones of the so-called 3.5 generation as well as its second generation platform... |
|
|
| |
««
«
273
274
275
276
277
»
»»
|
