| 23.05.2006 10:00 |
Infineon Demonstrates Second Generation Ultra Low-Cost GSM Single-Chip with Successful Live Phone Call |
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Munich - May 23, 2006 - Infineon Technologies AG today announced that the first E GOLDvoice chip produced in Dresden worked at the first attempt and has already been used to make phone calls on GSM networks. E-GOLDvoice is the most highly integrated chip for mobile telephony, combining all of a mobile ... |
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| 22.05.2006 10:10 |
Infineon Selected to Co-Develop Specialized Security Chips for Microsoft FlexGo |
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Munich, Germany – May 22, 2006 – Infineon Technologies AG (FSE/NYSE: IFX) today announced that it has been selected by Microsoft as a development partner for prepaid and subscription computing with Microsoft FlexGo™ technology. Under the agreement, Infineon is working with Microsoft to develop ... |
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| 17.05.2006 10:00 |
Infineon Receives Prestigious IEC InfoVision Award for VDSL2 IAD in the category Broadband Appliances, Devices, and Home Networking Solutions |
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Hong-Kong, SAR China - May 17, 2006 - Infineon Technologies was awarded today with the International Engineering Consortium’s (IEC) InfoVision Award at the Broadband World Forum (BBWF) Asia in Hong-Kong. Infineon’s complete VDSL2 design of an integrated access device (IAD) based on the company’s ... |
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| 16.05.2006 10:00 |
Infineon Enables Mass Deployment of Video Home Networking: Reliable Plastic Optical Fiber Solution Transmits High-Definition Content to the End-User’s TV or Audio Set |
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Munich, May 16, 2006 - Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, today announced a revolutionary plastic optical fiber (POF) to Ethernet transceiver solution that enables mass deployment of Video Home Networking driving IPTV and HDTV services. As opposed to ... |
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| 12.05.2006 09:00 |
Advanced 65nm mobile phone chip works first time - 30 million transistors integrated on one cell phone key |
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Munich, May 12, 2006 - Infineon Technologies AG announced today that the first cell phone chips equipped with its advanced 65-nm CMOS process technology are now available. The components functioned perfectly right from the start, as complicated testing in Duisburg, Munich and Bangalore, India has ... |
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| 27.04.2006 10:00 |
Infineon Introduces New Digital Cordless Phone Solution, Announces Roadmap to Single-Chip DECT to Drive Next Generation Standard |
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Munich, Germany – April 27, 2006 - Infineon Technologies, a leading provider of Communication ICs, today announced the availability of a new chipset for Digital Cordless Phones that supports advanced features and helps to reduce total system cost. Infineon also announced that it will integrate the ... |
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