Press Releases 1609 to 1614 of 1696
11.09.2006 16:00 Comneon Commences High Volume Shipments of its Open License 3G Protocol Stack: Represent the World’s First Openly-Licensable 2G/3G Dual Mode Solution to be Commercially Deployed
Munich - September 11, 2006 - Comneon GmbH, a leading supplier of software for mobile phones, today announced that its dual-mode 3G protocol stack is now shipping in high volumes with one of the industry’s Top-3 handset manufacturers.  This represents the first configurable 2G/3G dual mode protocol ...
11.09.2006 13:00 Infineon Introduces Highly-Integrated SoC Solutions to Enable Higher Performance, Cost-Optimized VoIP Solutions for Next Generation Residential Gateways
Munich, Germany - September 11, 2006 - Infineon Technologies AG (FSE/ NYSE: IFX) today announced a new family of highly-integrated System-on-Chip (SoC) solutions with dual-core architecture and several integrated peripherals.  The new TwinPass family targets digital home applications, such as ...
29.08.2006 14:00 IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45nm Low-Power Technology; Industry leaders Offer Reliable, High-Performance, Low Leakage Platform for Early adopters of Leading-Edge Process; Early Design Kits Available to Accelerate Transition
East Fishkill, NY; Singapore; Munich and Seoul - August 29, 2006 - IBM, Chartered Semiconductor Manufacturing, Infineon Technologies and Samsung Electronics Co., Ltd. today announced first silicon-functional circuits and the availability of design kits based on their collaboration for 45nm low-power...
21.08.2006 10:00 New US Passports Contain Secure Identification Chips from Infineon; Advanced Technology Meets International Standard for Secure Travel Documents
San Jose, Calif. and Munich, Germany – August 21, 2006 – Infineon Technologies AG (NYSE/FSE: IFX) today announced that it received a multi-million piece purchase order from the United States government to supply its highly-secure integrated circuit technology for the new electronic passport. ...
09.08.2006 15:00 Infineon Achieves Industry-Best Performance of Disk Drive Read Channel Based on 90 nm Technology; Core Targeted for SoC Supporting 6 Gbs Hard Disk Serial Interface Standards
Munich, Germany/San Jose, Calif. - August 9, 2006 - Infineon Technologies AG (FSE/ NYSE: IFX) today announced it has demonstrated functionality and data rates exceeding 2.6 Gbs (gigabits per second) for a hard disk drive read channel IC (integrated circuit) core, which is the industry’s highest data rate...
01.08.2006 22:00 Infineon Technologies, Qimonda and Tessera Conclude Licensing Agreement and Settle All Existing Claims
Munich, Germany - August 1, 2006 - Infineon Technologies AG (FSE/NYSE: IFX) and its subsidiary Qimonda AG today announced the conclusion of license agreements with Tessera Inc., San Jose, USA. Infineon, Qimonda and Tessera have also agreed to settle all outstanding litigation between them...
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