| Press Releases 103 to 108 of 1696 |
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| 24.07.2024 10:15 |
New Edge AI evaluation kit accelerates ML application development using microcontroller, connectivity, AI and sensor portfolio |
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Munich, Germany – 24 July 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the release of a comprehensive evaluation kit for embedded, Edge AI and Machine Learning (ML) system designs. The new PSoC™ 6 AI Evaluation Kit provides all the tools required to build intelligent consumer, smart home and IoT applications. The solution executes inferencing next to the sensor data source, providing such user benefits as enhanced real-time performance and power efficiency compared to cloud-centric solution architectures. Its small 35 mm x 45 mm form factor, affordable cost and broad range of integrated sensors and connectivity make it the perfect choice for in-field data collection, rapid prototyping, model evaluation and solution creation. |
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| 19.07.2024 09:15 |
Infineon contributes to industry's highest power density grid storage ground power conditioner from Daihen with 2000 V SiC Module |
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Munich, Germany, and Tokyo, Japan – 19 July 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its CoolSiC™ 2000 V modules have been selected by Daihen Corporation for their innovative unit-type power conditioners for grid storage batteries. In the journey towards reducing carbon emissions, both grid storage batteries and the power conditioners that are linked to them play a vital role in facilitating the wider adoption of renewable energy sources like solar and wind power generation. There has been an increasing demand for higher voltage storage batteries and power conditioners to enhance the effectiveness of power generation, storage, and transmission. Moreover, with the expansion of storage battery systems on a larger scale, finding suitable locations and minimizing construction costs have emerged as significant challenges. |
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| 18.07.2024 17:00 |
Infineon and Amkor sign Memorandum of Understanding to stimulate sustainable action across the supply chain |
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Munich, Germany & Tempe, Arizona, USA – 18 July 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a leader in power systems and IoT, has signed a Memorandum of Understanding with Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain. |
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| 16.07.2024 11:15 |
Innovative smart cockpit offering from Infineon and MediaTek enable cost efficient infotainment solutions for smart mobility |
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Munich, Germany – 16 July 2024 – The trend in the automotive industry is towards digital cockpits, with buttons and controls disappearing from the dashboard and being replaced by advanced displays. As one of the key systems in a vehicle, the digital cockpit system needs to deliver high performance features to the vehicle users while meeting functional safety targets. The traditional way to achieve such goals is to run the digital cockpit system on a high-performance SoC with a hypervisor. However, the up-front investment required to get started with such a system is in the seven-figure range, and the license fees for the operating system and hypervisor add to the overall cost of the system, making it economically unattractive for mid- to low-end car models. |
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| 03.07.2024 14:15 |
Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility |
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Munich, Germany – 3 July 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Swoboda jointly develop and market high-performance current sensor modules for automotive applications. The partnership combines the best-in-class current sensor ICs from Infineon with Swoboda's expertise in the development and industrialization of sensor modules to address the fast-growing market of sensing solutions for hybrid and electric vehicles. The collaborative high-performance current measurement solutions accelerate time-to-market for high-volume applications such as traction inverters and battery management systems, but also for other key automotive applications. |
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| 24.06.2024 10:15 |
Infineon extends its AIROC™ Wi-Fi 6/6E portfolio by introducing the powerful CYW5591x family of connected microcontrollers |
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Munich, Germany – 24 June 2024 – Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the company’s new AIROC™ CYW5591x Connected Microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth® Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox™ software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network. |
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